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Low temperature conformal silicon dioxide deposition using supercritical fluid for polymer-based MEMS

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6 Author(s)
H. Yamada ; 3D BEANS Center, BEANS Project, JAPAN ; T. Momose ; Y. Kitamura ; Y. Hattori
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A novel supercritical fluid deposition method (SCFD) of SiO2 has been developed for polymer-based MEMS. In order to reduce deposition temperature for the application to polymer-based MEMS process, we selected O3 as an oxidant in SiO2-SCFD. Conformal SiO2 deposition on Si trenches (aspect ratio 24) at low temperatures (below 200°C) was achieved, which were acceptable for deposition on polymers. In addition, SiO2 coating on inner wall surface of microchannels, which was made of polydimethylsiloxane (PDMS), was demonstrated.

Published in:

Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on

Date of Conference:

23-27 Jan. 2011