By Topic

Cost effective, mass productive Wafer-Level Chip Size Package (WLCSP) technology applied to Ku-band frequency converters

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
S. Fujita ; Sumitomo Electric Device Innovations, Inc., 1000 Kamisukiawara, Showa-cho, Nakakoma-gun, Yamanashi, 409-3883 Japan ; M. Imagawa ; T. Satoh ; T. Tokumitsu
more authors

Cost effective, mass productive Ku-band up- and down-converter MMIC's for wireless communication are presented. These MMIC's are designed by using a three-dimensional MMIC technology that optimized for flip-chip solder reflow-compatible implementation; hence, that removes necessity of packaging. The MMIC structure incorporates inverse TFMS lines so that a ground metal can be applied to cover the whole chip surface except for interconnect pads. Among multi-polyimide and SiN layers, four wiring metal layers are composed. The up-converter MMIC's were composed of a pair of balanced mixers, which are doubly balanced with additional quadrature couplers and a LO amplifier. The down-converter is composed of an image-rejection mixer, a LO amplifier and low-noise amplifier. The components are effectively integrated in a 2.4mm × 2.4mm die. An up-converter exhibited a Gc of -12dB, an IIP3 of nearly 20dBm, and a LO-to-RF leakage of less than -35dBm for a 0dBm of LO input. A 13-15GHz down-converter exhibited a Gc of +12dB, an IIP3 of better than 0dBm, and an image-rejection ratio of greater than 20dB (>;30dB for flip-chip assembly) for a 2dBm of LO input. The measurements were performed in both the face-up (with RF-Probe) and flip-chip fashions. An LTCC package implementation was also examined. As a result, the RF performances did not depend on these measurement states and showed high repeatability. We also present the mass productivity of WLCSP MMIC by showing statistical data.

Published in:

2010 Asia-Pacific Microwave Conference

Date of Conference:

7-10 Dec. 2010