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Packaging structures utilizing new `pinless' grid array technologies and vacuum well processes to provide enhanced reliability and circuit densities

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1 Author(s)

An innovative technology that yields greater VLSI/VHSIC packaging densities and reliability while meeting military requirements including solderability and inspectability. The approach is called pinless grid array (PLGA) technology. Its reliability is examined, and its capability for increasing radiation hardness of electronic systems is briefly discussed

Published in:

Custom Integrated Circuits Conference, 1989., Proceedings of the IEEE 1989

Date of Conference:

15-18 May 1989