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Wafer-Level Epitaxial Silicon Packaging for Out-of-Plane RF MEMS Resonators With Integrated Actuation Electrodes

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6 Author(s)
Kuan-Lin Chen ; InvenSense, Inc., Sunnyvale, CA, USA ; Shasha Wang ; Salvia, J.C. ; Melamud, R.
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This paper presents an integrated solution for wafer-level packaging and electrostatic actuation of out-of-plane radio frequency microelectromechanical system resonators. By integrating the electrodes into the epitaxial-grown silicon layer, both the encapsulation and the out-of-plane actuation can be built in one process step, which results in an ultracompact and robust packaging. First, designs and fabrication processes of the out-of-plane electrode are described. The mechanical and electrical properties of the electrode are discussed, modeled, and characterized. A 200 kHz torsional mode beam resonator and an 11.2 MHz transverse-mode differential square plate resonator are fabricated using this packaging method and their performances are presented and discussed.

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Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:1 ,  Issue: 3 )