Temperature-Power Consumption Relationship and Hot-Spot Migration for FPGA-Based System

Heat emission and temperature control in an electronic device is known to be highly correlated to power consumption as well as to equipment's reliability. Within this context, this paper discusses a possible solution to restrict processing component's heat emission in FPGA-based system (e.g., Cognitive Radio (CR) equipment). It also describes the implementation, on reconfigurable FPGA based circuit, of a digital thermal sensor, analyzes the applicability of local heat estimations, and empirically describes the temperature-power consumption relationship in a dynamically reconfigurable FPGA platform. Finally, discussions are conducted on the decision making issues related to the use of such sensors to enable ``hot-spot'' migration in CR equipment.