Referenced Items are not available for this document.
This study reports the packaging effects of a small-outline package (SOP) on overall electrical characteristics of RFICs. The parameters of an equivalent coupled-π model circuit are extracted from simulated S-parameters at low frequency. These parameters are then optimized over the desired frequency range for better accuracy. To verify the obtained circuit model, the tuning characteristic of a voltage controlled oscillator (VCO) was tested. The circuit is fabricated using a 0.5 um N-well CMOS process, and packaged in a 28-lead SOP plastic package. Experimental results are shown to closely match the simulation results.
Published in:
Electronics, Circuits, and Systems (ICECS), 2010 17th IEEE International Conference on
Date of Conference: 12-15 Dec. 2010
- Page(s):
- 1072 - 1075
- Print ISBN:
- 978-1-4244-8155-2
- INSPEC Accession Number:
- 11861786
- Conference Location :
- Athens
- Digital Object Identifier :
- 10.1109/ICECS.2010.5724701
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
