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A Compact Loop Heat Pipe With Flat Square Evaporator for High Power Chip Cooling

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3 Author(s)
Ji Li ; College of Physics, Graduate University, Chinese Academy of Sciences, Beijing, China ; Daming Wang ; G. P. Bud Peterson

In this paper, systematic experimental and theoretical investigations were carried out on a copper-water compact loop heat pipe with a flat square evaporator having a bottom area of 30 mm × 30 mm. Wick structure inside the evaporator was made of fine copper powder with carefully designed vapor removal channels sintered directly on the substrate. In addition, the design and fabrication of a 120 mm air-cooled condenser was given adequate consideration. From the experimental tests, it is found that such a small loop heat pipe can manage a heat load of more than 600 W, and no dry-out occurs. In the favorable vertical configuration, with an air velocity of 2.8 m/s, this compact loop heat pipe has a thermal resistance as low as 0.042°C/W, with a corresponding evaporator thermal resistance as low as 0.018°C/W . As well, the theoretical analysis agrees in principle with the experimental data.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:1 ,  Issue: 4 )