By Topic

Development of sensor scanning type space charge measurement system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
M. Fukuma ; Matsue College of Technology, Department of Electrical Engineering, 14-4, Nishiikuma, Shimane, 690-8518, Japan ; N. Masuda ; K. Fukunaga

Non-destructive space charge measurement techniques have been used to investigate space charge behavior in insulating materials. Real time space charge measurement systems are also required to observe the localized space charge distribution in insulating materials. Since the space charge behavior is generally in transient, a real time measurement system will be also required in the two or three (2D or 3D) dimensional space charge measurement systems. In the pulsed electro-acoustic (PEA) method, the three dimensional (3D) space charge measurement systems using acoustic lens have been developed, and the real time 2D space charge measurement system has been also developed using multi-sensor array. However, the 3D system takes measuring time of movement of the lens and the 2D system takes cost of system because A/D converters must be connected to each sensor in the sensor array. A 2D dimensional space charge measurement system in lateral and thickness direction for transient space charge has been developed using the sensor array and semiconductor analog switch unit in the PEA method. In this report, fundamental performances of the developed 2D space charge measurement system are introduced.

Published in:

Electrical Insulation and Dielectric Phenomena (CEIDP), 2010 Annual Report Conference on

Date of Conference:

17-20 Oct. 2010