IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | 

Close category search window
Author Searchbeta |  Advanced Search  |  Preferences |  Search Tips  |  More Search Options  
 
Browse Conference Publications > Electrical Performance of Ele ... Help

An efficient methodology for the design of optimum electrical performance of interconnect in high performance systems

Full Text Sign-In or Purchase

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing! close button
puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Rahal-Arabi, T. ; Intel Corporation, Architecture Development Laboratory, Interconnect Technology Development, 5200 N. E. Elam Young Parkway, Hilsboro, Oregon 97124 ; Suarez-Gartner, R.

First Page of the Article

Published in:
Electrical Performance of Electronic Packaging, 1992

Date of Conference: 22-24 Apr 1992

Page(s):
4 - 6
Print ISBN:
0-7803-0683-X
Digital Object Identifier :
10.1109/EPEP.1992.572249
Product Type:
Conference Publications

IEEE Account

Purchase Details

Profile Information

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.