Cart (Loading....) | Create Account
Close category search window

On-chip artificial transmission lines, enabling compact Si-based mmWave ICs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Trivedi, V.P. ; Freescale Semicond. Inc., Tempe, AZ, USA ; Kun-Hin To ; Huang, W.M.

On-chip integration of artificial (slow-wave) transmission lines (ATL) formed by periodic loading of microstrip lines with MIM capacitors is demonstrated, for the first time, using 0.18μm SiGe:C BiCMOS. We demonstrate 2× length-reduction of λ/4-stub RF choke and filters at 38GHz and at 77GHz. Due to the extensive use of TLs in mmWave design, ATL has more potential for enabling compact mmWave design than technology scaling. A simplified theory is also presented to design mmWave ATLs. Finally, BEOL-based metal-on-metal (MOM) capacitor instead of MIM capacitor is proposed for ATL improvement based on RF characterization of 65nm CMOS.

Published in:

Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2011 IEEE 11th Topical Meeting on

Date of Conference:

17-19 Jan. 2011

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.