Cart (Loading....) | Create Account
Close category search window

A Novel Compact Forward-Wave Directional Coupler Design Using Periodical Patterned Ground Structure

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Sen-Kuei Hsu ; Dept. of Electr. of Eng., Nat. Taiwan Univ., Taipei, Taiwan ; Jui-Chih Yen ; Tzong-Lin Wu

A novel forward-wave directional coupler with periodical patterned ground structures is proposed. The input impedance of the even and odd mode of the proposed coupler can be matched, and the phase difference between the even and odd mode is also strongly enhanced. The equivalent models are constructed to predict the propagation properties based on the Bloch-Floquet theorem. A completed design procedure is also proposed based on the equivalent models. This two-layer structure is fabricated on Duroid substrate. 0.5-dB coupling level can be measured at 1.5 GHz, and the coupler length is 0.5 λg. Compared to previous studies, the proposed coupler can be designed at a lower frequency range with a smaller size.

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:59 ,  Issue: 5 )

Date of Publication:

May 2011

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.