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Multi-Chip Module Packaging For W-Band {\rm LiNbO}_{3} Modulator

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4 Author(s)
Shireen, R. ; Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE, USA ; Shouyuan Shi ; Peng Yao ; Prather, D.W.

This letter presents ribbon bond transition of coplanar waveguides (CPWs) between two largely different dielectric constant materials, lithium niobate (LiNbO3) and alumina (Al2O3). The design plays an important role in multi-chip module (MCM) integrations of optoelectronic devices on LiNbO3 for the applications of millimeter-wave to optical signal processing. The impacts of ribbon bond parameters and CPW dimensions on the transmission characteristics are investigated over 100 GHz bandwidth. Simulated results are confirmed by measurements of the fabricated device.

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:21 ,  Issue: 3 )