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MEMS VOA based on torsional and bending attenuation mechanisms using piezoelectric cantilever integrated with 1×10 PZT thin film actuators

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3 Author(s)
Kah How Koh ; Department of Electrical & Computer Engineering, National University of Singapore ; Takeshi Kobayashi ; Chengkuo Lee

A gold coated silicon mirror (5 mm × 5mm) actuated by piezoelectric Pb(Zr, Ti)O3 (PZT) cantilever beams has been investigated for variable optical attenuator applications. The device is micromachined from a SOI substrate with 5μm thick Si device layer, with multi-layers of Pt/Ti/PZT/Pt/Ti deposited as electrode materials. A large Si mirror plate and a 1×10 arrayed PZT cantilevers arranged in parallel are formed after the release process. The ten cantilevers are designed to be electrically isolated from one another. A dual core fiber collimator is aligned perpendicularly to the mirror in a three-dimensional (3-D) light attenuation arrangement. Two modes of attenuation mechanisms were investigated based on bending and torsional effects. A dynamic attenuation range of 40dB achieved at 1V and 1.8V for bending and torsional mode respectively.

Published in:

Photonics Global Conference (PGC), 2010

Date of Conference:

14-16 Dec. 2010