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Dual Grid Array Antennas in a Thin-Profile Package for Flip-Chip Interconnection to Highly Integrated 60-GHz Radios

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4 Author(s)
Zhang, Y.P. ; Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore ; Sun, M. ; Duixian Liu ; Lu, Y.

We examine the current development of highly integrated 60-GHz radios with an interest in antenna-circuit interfaces. We design and analyze grid array antennas with special attention to the differential feeding and the patterned ground plane. More importantly, we integrate two grid array antennas in a package; propose the way of assembling it to the system printed circuit board; and demonstrate a total solution of low cost and thin profile to highly integrated 60-GHz radios. We show that the package in low temperature cofired ceramic (LTCC) technology measures only 13×13×0.575 mm3 ; can carry a 60-GHz radio die of current and future sizes with flip-chip bonding; and achieves good antenna performance in the 60-GHz band with maximum gain of 13.5 and 14.5 dBi for the single-ended and differential antennas, respectively.

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Antennas and Propagation, IEEE Transactions on  (Volume:59 ,  Issue: 4 )