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Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

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5 Author(s)
Jiayin Li ; Dept. of Electr. & Comput. Eng., Univ. of Kentucky, Lexington, KY, USA ; Meikang Qiu ; Jianwei Niu ; Tianzhou Chen
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Chip multiprocessor technique has been implemented in embedded systems due to the tremendous computation requirements. Three dimension chip multiprocessor architecture has been studied recently for integrating more functionalities and providing higher performance. The high temperature on chip is a critical issue for the 3D architecture. In this paper, we propose an online thermal prediction model for 3D chip. Using this model, we present a task scheduling algorithm based on rotation scheduling to reduce the peak temperature on chip. We consider the data dependencies, especially the inter-iteration dependencies which are not well considered in most of the current thermal-aware task scheduling algorithms. Our simulation result shows that our algorithm can efficiently reduce the peak temperature up to 10°C.

Published in:

Embedded and Ubiquitous Computing (EUC), 2010 IEEE/IFIP 8th International Conference on

Date of Conference:

11-13 Dec. 2010