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Thermal-aware design of 3D ICs with inter-tier liquid cooling

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1 Author(s)
Atienza, D. ; Embedded Syst. Lab. (ESL), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland

Microchannel-based liquid cooling is a promising technology solution to overcome the thermal challenges of 3D MPSoCs. However, intelligent control of the coolant flow rate is needed to avoid wasted energy consumption for over-cooling the system when the system is under-utilized. Therefore, this paper proposes a novel system-level thermal-aware design as an affective method to achieve thermally-balanced 3D MPSoCs.

Published in:

Electron Devices Meeting (IEDM), 2010 IEEE International

Date of Conference:

6-8 Dec. 2010