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Thruchip interface (TCI) for 3D integration of low-power system

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1 Author(s)
Kuroda, T. ; Keio Univ., Yokohama, Japan

This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.

Published in:

Electron Devices Meeting (IEDM), 2010 IEEE International

Date of Conference:

6-8 Dec. 2010