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The interplay between radiation effects and reliability is discussed for micro- and optoelectronic devices. Topics discussed include basic approaches such as burn-in and electrical screening that are used to improve component reliability, synergistic effects between reliability and radiation effects, the impact of microdose damage from heavy ions on reliability of high-density digital circuits, and assessing the overall risk to components in space that are subjected to overstress conditions.
Device and Materials Reliability, IEEE Transactions on (Volume:10 , Issue: 4 )
Date of Publication: Dec. 2010