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Design and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance

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3 Author(s)
Ying Ying Lim ; Inst. of Microelectron., A*STAR (Agency for Sci., Singapore, Singapore ; Rajoo, R. ; Ser Choong Chong

Recent trends favour the widespread adoption of RFID technology for supply chain and retail applications. To be economically viable, the tags have to be manufactured with a low unit cost. Thus, a fabrication technology which involves inexpensive processes is highly desirable. This work discusses the design and fabrication of embedded passives on flex. In particular, some guidelines are provided for the design of inductors. Lastly, the passives were subjected to some reliability evaluation and their performance ascertained.

Published in:

Electronics Packaging Technology Conference (EPTC), 2010 12th

Date of Conference:

8-10 Dec. 2010

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