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A two-die stacked silicon module with TSV has been developed in this work. Thermal-mechanical analysis has been performed and TSV interconnect design is optimized. Multiple chips representing different functional circuits are assembled using flip chip interconnection methods. Silicon carrier is fabricated using via-first approach, the burrier copper via is exposed by special backgrinding process. A two-dimensional plane strain analysis using the global-local technique, based on St. Venant's principle, is performed on the diagonal cross-section of the wafer. The thermal-mechanical modeling has shown that the shear stress Sxy at the micro-bump, compressive stress Sy at the interconnection and shear stress Sxy at the TSV are reduced for off-pad via as compared to on-pad via. This is because the CTE mismatch between the micro-bump and TSV is no longer effective when the TSV is offset. Also the work presented that the offset distance of the off-pad via does not have an impact to the compressive stress Sy and shear stress Sxy at the interconnection. There are also no significant changes in the shear stress Sxy at the TSV as the off-pad via moves outward to the die edge. As we knows that the bending stress Sx is a major factor contributing to die cracking due to coefficient of thermal expansion (CTE) mismatch. Our simulation results showed that the bending stress Sx of the top die and bottom die was not affected by increasing the offset distance of the off-pad via even to the die edge. Thus it is an advantage to plate the through-silicon-via away from the micro-bump to avoid stresses complication arises from CTE mismatch.