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Void formation, intermetallic compound dissolution and metallization consumption at cathode interface are major degradation processes of electromigration in solder joints, but decisive factors for the phenomena are not clear. The article provides a new perspective to describe the electromigration behavior. We analyzed the temperature effects on Cu and Sn electromigration fluxes in Sn. The calculated result showed low temperature retards Sn electromigration flux by three orders of magnitude more effectively than Cu, which implied intermetallic compound dissolution and metallization consumption at cathode will be the dominant feature at low temperature. The calculated result was verified by low temperature electromigration tests in flip chip solder joint.