Referenced Items are not available for this document.
A Cu/Ni UBM and Sn-2.5Ag lead-free solder for 20 μm pitch micro-bump was successfully fabricated via consecutive electroplatings of Cu, Ni, and binary SnAg. Materials characterizations such as Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), Electron Probe Micro-analyzer (EPMA), and X-ay Photoelectron Spectroscopy (XPS) were carried out to obtain relevant materials properties. We observed a strong effect of the plating current density on the resulting bump morphologies. After reflow, the solder revealed a spherical shape with a composition variation within 0.2 wt%.
Published in:
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Date of Conference: 20-22 Oct. 2010
- Page(s):
- 1 - 4
- ISSN :
- 2150-5934
- E-ISBN :
- 978-1-4244-9785-0
- Print ISBN:
- 978-1-4244-9783-6
- INSPEC Accession Number:
- 11762795
- Conference Location :
- Taipei
- Digital Object Identifier :
- 10.1109/IMPACT.2010.5699591
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