By Topic

The stress-strain relationship of Sn63Pb37 and SAC305 solder materials at elevated temperature condition

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Syh-Tsang Jenq ; Dept. of Aeronaut. & Astronaut., Nat. Cheng Kung Univ., Tainan, Taiwan ; Yuen-Sheng Chiu ; Ren-Jey Lin ; Yi-Shao Lai

This paper is emphasized on the compression behavior of Sn-3Ag-0.5Cu (SAC305) and Sn-37Pb at elevated temperatures. The effect of temperature for Sn-3Ag-0.5Cu (SAC305) and Sn-37Pb alloys was also discussed. The Quasi-static compression test was also conducted by using the SHIMAZDU AG-X material testing machine and the loading rare was chosen to be 1.67×10-3 s-1 and 1.67×10-4 s-1. Moreover, heating oven was utilized to control the specific temperatures (approximately 30°C, 60°C and 90°C), and the corresponding K-type digital thermometer was used to record the temperature during the tests. According to the several strain-rate ranges studied, the limited strain-rate hardening effect for these alloys studied were reported. In addition, the effect of elevated temperature on the solder material softening was also presented. The test determined saturation stresses were also presented for both Sn-3Ag-0.5Cu (SAC305) and Sn-37Pb solders, and relationship among the saturation stresses, strain-rate hardening and material soften is discussed.

Published in:

Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International

Date of Conference:

20-22 Oct. 2010