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Advanced solutions for 3D integration of heterogeneous individual chips

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1 Author(s)
Poupon, G.

First Page of the Article

Published in:
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International

Date of Conference: 20-22 Oct. 2010

Page(s):
1 - 50
ISSN :
2150-5934
E-ISBN :
978-1-4244-9785-0
Print ISBN:
978-1-4244-9783-6
INSPEC Accession Number:
11762741
Conference Location :
Taipei
Digital Object Identifier :
10.1109/IMPACT.2010.5699502
Product Type:
Conference Publications

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