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Updated results of R&D on Functionally Innovative 3D-Integrated Circuit (Dream Chip) technology in FY2009

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1 Author(s)
Kada, M. ; Association of Super-Advanced Electronics Technologies

In the NEDO "Dream Chip Project", ASET has been entrusted a project for developing, "Functionally Innovative 3D-Integrated Circuit". In the five year project from 2008 to 2012, development on technologies for design environment, chip test, interposer, cooling and stacking/bonding, thin wafer, and development on demonstration device, process and 3D Reconfigurable Device Technology are being performed.

Published in:
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International

Date of Conference: 20-22 Oct. 2010

Page(s):
1 - 2
ISSN :
2150-5934
E-ISBN :
978-1-4244-9785-0
Print ISBN:
978-1-4244-9783-6
INSPEC Accession Number:
11762739
Conference Location :
Taipei
Digital Object Identifier :
10.1109/IMPACT.2010.5699496
Product Type:
Conference Publications

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