Referenced Items are not available for this document.
In this paper, the method of lines (MoL) is used to compute the 2-D and 3-D capacitance matrices of multiconductor interconnects with finite metalization thickness that are embedded in conformal multilayered dielectric media. Results show a good agreement with the published data. By contrast, this technique has efficient calculation and flexible handling of conductors having arbitrarily shaped topology
Published in:
Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE
Date of Conference: 4-5 Feb 1997
- Page(s):
- 98 - 101
- Meeting Date :
- 04 Feb 1997-05 Feb 1997
- Print ISBN:
- 0-8186-7789-9
- INSPEC Accession Number:
- 5602097
- Conference Location :
- Santa Cruz, CA
- Digital Object Identifier :
- 10.1109/MCMC.1997.569351
- Product Type:
- Conference Publications
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