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Fast extraction of the capacitance matrix of multilayered multiconductor interconnects using the method of lines

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4 Author(s)
Xiaohong Jiang ; Dept. of Electr. & Comput. Eng., Ecole Polytech. de Montreal, Que., Canada ; Ke Wu ; Wei Hong ; Wayne Wei-Ming Dai

In this paper, the method of lines (MoL) is used to compute the 2-D and 3-D capacitance matrices of multiconductor interconnects with finite metalization thickness that are embedded in conformal multilayered dielectric media. Results show a good agreement with the published data. By contrast, this technique has efficient calculation and flexible handling of conductors having arbitrarily shaped topology

Published in:

Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE

Date of Conference:

4-5 Feb 1997