By Topic

A Virtual Metrology System for Predicting End-of-Line Electrical Properties Using a MANCOVA Model With Tools Clustering

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Tian-Hong Pan ; School of Electrical & Information Engineering, Jiangsu University, Zhenjiang, Jiangsu, China ; Bi-Qi Sheng ; David Shan-Hill Wong ; Shi-Shang Jang

The ability to predict end-of-line electrical properties of wafer in semiconductor manufacturing processes is critical to developing and maintaining a high yield. However, this is difficult because an advanced wafer manufacturing process consists of 300-400 steps, and in-line metrology data is only available for a few steps and for infrequently sampled wafers. Although a large amount of equipment sensor outputs are readily available for most wafers, most of the sensor variables may not be related to the end-of-line properties. Further, differences in end-of-line properties of wafers processed by tools of the same stage do not imply differences in the values of sensor variables between these tools. Thus, it is important to develop a reliable screening and model building procedure to construct a robust virtual metrology model with good generalization capability. Despite its simplicity, this approach is found to have significantly better generalization capability than nonlinear models, as well as substantial improvement in modeling and prediction capabilities of linear models that use only in-line metrology. The proposed method is also evaluated by an industrial application in a local fabrication unit.

Published in:

IEEE Transactions on Industrial Informatics  (Volume:7 ,  Issue: 2 )