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A Test Integration Methodology for 3D Integrated Circuits

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6 Author(s)
Che-Wei Chou ; Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan ; Jin-Fu Li ; Ji-Jan Chen ; Ding-Ming Kwai
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The three-dimensional (3D) integration technology using through silicon via (TSV) provides many benefits over the 2D integration technology. Although many different manufacturing technologies for 3D integrated circuits (ICs) have been presented, some challenges should be overcome before the volume production of 3D ICs. One of the challenges is the testing of 3D ICs. This paper proposes test integration interfaces for controlling the design-for-test circuits in the dies of a 3D IC. The test integration interfaces can support the pre-bond, known-good stack, and post-bond tests. The minimum number of required test pads of the proposed test interface for pre-bond test using is only four. Furthermore, the test interface is compatible with the IEEE 1149.1 standard for the board-level testing. Simulation results show that the area overhead of the proposed test interfaces for a 3D IC with two dies in which each die implements the function of ITC'99 b19 benchmark is only about 0.15%.

Published in:

Test Symposium (ATS), 2010 19th IEEE Asian

Date of Conference:

1-4 Dec. 2010