By Topic

Using Ionizers to Reduce Electrostatically Adhered Particles on Wafer Backside

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Pandit, V.S. ; Novellus Syst., Inc., San Jose, CA, USA ; Kuo, E.Y.

We present results and discussion on the positive impact of ionizer(s) used in multiple configurations on wafer backside and front-side particle adders in physical vapor deposition (PVD) processing tools. We provide a hypothesis, followed by testing, that establishes a relationship between electrical surface charge collection data and particle data obtained in a laboratory setting as well as a real-world wafer fabrication facility environment. For chip manufacturers, controlling surface charges on production wafers results in a reduced number of undesirable particles, thereby resulting in higher yield, more reliable final product chips, and reduced product losses. And for equipment manufacturers, more reliable and better tool performance can lead to increased productivity. The INOVA PVD system's good particle performance, as demonstrated on good quality wafers, is made marginal quality wafersmore robust with an ionizer installation when marginal quality wafers are used.

Published in:

Semiconductor Manufacturing, IEEE Transactions on  (Volume:24 ,  Issue: 2 )