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A new methodology for IC-package thermal co-analysis in 3D IC environment

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3 Author(s)
Stephen H. Pan ; Apache Design Solutions, 2645 Zanker Rd., San Jose, CA 95134 ; Norman Chang ; Ji Zheng

Power on chip is highly temperature dependent in deep sub-micron VLSI. With increasing power density in modern 3D-IC and SiP, thermal induced reliability and performance issues such as leakage power and electromigration must be taken into consideration in the system level design. This paper presents a new methodology to accurately and efficiently predict power and temperature distribution for 3D ICs.

Published in:

2010 IEEE Electrical Design of Advanced Package & Systems Symposium

Date of Conference:

7-9 Dec. 2010