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3D integration increases chip integration density, reduces wire length, wire delay and power consumption on wires. However, increased power density causes increase of temperature, which results in the increase of leakage power consumption and performance degradation. In this paper, we propose a solution to compromise these issues on stacking cache memory on a processor core. Experimental results have shown that the proposed method yields, on the average, 16% performance improvement in terms of instructions per second compared to conventional method. The proposed method also reduces energy consumption by 20% on average, in terms of energy per instruction.
SoC Design Conference (ISOCC), 2010 International
Date of Conference: 22-23 Nov. 2010