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Thermal management via task scheduling for 3D NoC based multi-processor

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4 Author(s)
Han Wang ; Sch. of Microelectron., Shanghai Jiaotong Univ., Shanghai, China ; Yuzhuo Fu ; Ting Liu ; Jiafang Wang

3D IC technology drives Network-On-Chip (NoC) design on towards 3D trend and relevant multi-core system further development. Thermal issue becomes more critical because of the increasing power density caused by 3D stack. OS-level task scheduling is an effective method to improve on-chip temperature condition. In this paper we propose a thermal management method using task scheduling to limit chip temperature under required constraints as well as consider performance degradation caused by moving task to a core far away from its data. A temperature controller is implemented in our simulator to determine temperature management actions. The result shows our algorithm has lower performance loss with the same temperature constraint compared to coldest and random scheduling.

Published in:

SoC Design Conference (ISOCC), 2010 International

Date of Conference:

22-23 Nov. 2010