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This paper analyzes the impacts of intrinsic process variations and negative bias temperature instability (NBTI)/positive BTI (PBTI)-induced time-dependent variations on the stability/variability of 6T FinFET static random access memory (SRAM) cells with various surface orientations and gate dielectrics. Due to quantum confinement, (110)-oriented pull down n-channel FETs with fin line-edge roughness (LER) show larger Vread,0 and Vtrip variations, thus degrading READ static noise margin (RSNM) and its variability. Pull-up p-channel FETs with fin LER that are (100)-oriented show larger Vwrite,0 and Vtrip variations, hence degrade the variability of WRITE SNM. The combined effects of intrinsic process variations and NBTI/PBTI-induced statistical variations have been examined to optimize the FinFET SRAM cells. Worst-case stress scenario for SNM stability/variability is analyzed. With the presence of both NBTI and PBTI in high-fe metal-gate FinFET SRAM, the RSNM suffers significant degradation as Vread,0 increases, whereas Vtrip simultaneously decreases. Variability comparisons for FinFET SRAM cells with different gate stacks (SiO2 and SiO2/HfO2) are also examined. Our paper indicates that the consideration of NBTI/PBTI-induced temporal variation changes the optimal choice of FinFET SRAM cell surface orientations in terms of the μ/σ ratio in RSNM.