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Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

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7 Author(s)
Joohee Kim ; KAIST, Daejeon, South Korea ; Jun So Pak ; Jonghyun Cho ; Junho Lee
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For the higher bandwidth and the smaller form factor, high-speed I/O channel design in 3D IC becomes more important. To analyze the differential signaling method with the TSV (Through Silicon Via) in 3D IC, we propose the high-frequency scalable model for the differential signal TSV. With the proposed model, the electrical behavior of the differential signal TSV is analyzed and compared to that of a single-ended signal TSV in various point of views.

Published in:

2010 IEEE CPMT Symposium Japan

Date of Conference:

24-26 Aug. 2010