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Design trade-off for resonance reduction of multiple power planes in Super Ball Grid Array (SBGA) package

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8 Author(s)
GaWon Kim ; Amkor Technology Korea, 280-8, 2-ga, Seongsu-dong, Seongdong-gu, Seoul, Korea, 133-706 ; SeungJae Lee ; JiHeon Yu ; Ozgur Misman
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In this paper, package co-design procedure with electrical simulation supported by Amkor Technology will be described and design trade-off for effective power/ground plane design in SBGA package will be discussed. Two models of SBGA design, which has five kinds of main and sub-main power nets, are compared using 3D electromagnetic (EM) simulation tool. By comparison of both design, inevitable design trade-off for effective multiple power planes will be presented and discussed from power integrity (PI) viewpoint. The revised SBGA package design was implemented and measured to analyze plane resonances in the impedance profile of each power/ground planes according to frequencies up to 10 GHz so that the simulated self-impedances can be compared with measured results.

Published in:

2010 IEEE CPMT Symposium Japan

Date of Conference:

24-26 Aug. 2010