By Topic

PoP prototyping by determination of matter transport effects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
L. Meinshausen ; LFI, Leibniz University Hannover, Schneiderberg 32, 30167 Hannover, Germany ; K. Weide-Zaage ; W. Feng ; H. Frémont

The assemblies “PoP” (Package-on-Package) can significantly increase the integration density of microelectronic circuits and systems, by vertically combining discrete semiconductor elements. Related to reliability especially migration phenomena, which are investigated here by simulation and measurements, become more important as the dimension of bumps decreases. To explore the influence of migration phenomena to the lifetime of PoPs a test card for current stress tests was designed. Furthermore, an exploration IMC growth was carried out. For a detailed interpretation of the test results FEM simulations with ANSYS® were performed. Finally, the results were used to predict the lifetime of the daisy chains and to calculate the activation energy for the IMC formation.

Published in:

2010 IEEE CPMT Symposium Japan

Date of Conference:

24-26 Aug. 2010