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A wafer-level system integration technology for flexible pseudo-SOC incorporates MEMS-CMOS heterogeneous devices

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7 Author(s)
Yamada, H. ; Corp. R&D Center, Toshiba Corp., Kawasaki, Japan ; Onozuka, Y. ; Iida, A. ; Itaya, K.
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A flexible pseudo-SoC which integrates electrostatic MEMS and its driver CMOS-LSI for mobile electronics device applications has been developed. From the experiments, the pseudo-SoC process has succeeded to form a fine-pitch on-chip global layer on the MEMS and CMOS-LSI embedded in the epoxy resin and to realize total thickness of 100 μm. This paper reports the pseudo-SoC that overcomes the limitation of system integration and provides the complementary advantages of SiP and SoC within the results of a highly-integrated flexible pseudo-SoC incorporating electrostatic MEMS and its driver CMOS-LSI for mobile electronics applications.

Published in:

CPMT Symposium Japan, 2010 IEEE

Date of Conference:

24-26 Aug. 2010