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Power Noise Suppression Using Power-and-Ground Via Pairs in Multilayered Printed Circuit Boards

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3 Author(s)
Mu-Shui Zhang ; Dept. of Electronics & Communication Engineering, Sun Yat-Sen University, Guangzhou Higher Education Mega Center, Panyu District, GuangZhou, China ; Jun-Fa Mao ; Yun-Liang Long

In this paper, an efficient power noise suppression method using power-and-ground (PG) via pair array in multilayered printed circuit boards (PCBs) is proposed. The power noise suppression performance is doubled by using both power and ground vias compared with the ground via array. The stopband bandwidth of the PG via pair array is derived. The evolvement from mushroom electromagnetic bandgap (EBG) structure to PG via pair array is demonstrated. The proposed method has overcome many shortcomings of the mushroom EBG structures. It is shown that the PG via pair array has excellent power noise suppression, signal integrity (SI), and electromagnetic compatibility (EMC) performance. It is a comprehensive power noise suppression scheme.

Published in:

IEEE Transactions on Components, Packaging and Manufacturing Technology  (Volume:1 ,  Issue: 3 )