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Reliability Modeling and Management of Nanophotonic On-Chip Networks

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11 Author(s)
Zheng Li ; Inst. of Microelectron., Tsinghua Univ., Beijing, China ; Mohamed, M. ; Xi Chen ; Dudley, E.
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While transistor performance and energy efficiency have dramatically improved in recent years, electrical interconnect improvements has failed to keep pace. Recent advances in nanophotonic fabrication have made on-chip optics an attractive alternative. However, system integration challenges remain. In particular, the parameters of on-chip nanophotonic structures are sensitive to fabrication-induced process variation and run-time spatial thermal variation across the die. This work addresses the performance and reliability challenges that arise from this sensitivity to variation. The paper first presents a model predicting the system-level effects of thermal and process variation in nanophotonic networks. It then shows how to optimize many-core system performance and reliability by using run-time techniques to compensate for the thermal and process variation effects.

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Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:20 ,  Issue: 1 )