By Topic

Ultra-Wideband Power Divider Using Multi-Wafer Packaging Technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Xing Lan ; Aerospace Systems, Northrop Grumman, Redondo Beach, CA, USA ; Patty Chang-Chien ; Flavia Fong ; David Eaves
more authors

A compact ultra-wideband Wilkinson power combiner/divider is first demonstrated using a hermetic multi-wafer wafer level packaging technology. Its bandwidth is broadened to around 2-22 GHz with a maximum VSWR around 2:1, by using a multi-section design approach. A total of four sections are adopted to achieve better than 20 dB isolation between output ports across the majority of a 3-19 GHz band. The first two stages are implemented on the first wafer, with the last two stages on the second wafer. This configuration significantly reduces the chip size and volume and makes the multi-section wideband divider viable for monolithic microwave integrated circuit implementation. To the authors' knowledge, this is the smallest Wilkinson power divider ever reported for such a wide bandwidth.

Published in:

IEEE Microwave and Wireless Components Letters  (Volume:21 ,  Issue: 1 )