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Packaging and Assembly for Integrated Photonics—A Review of the ePIXpack Photonics Packaging Platform

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5 Author(s)
Zimmermann, L. ; Leibniz-Inst., IHP Microelectron., Frankfurt (Oder), Germany ; Preve, G.B. ; Tekin, T. ; Rosin, T.
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We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devices.

Published in:

Selected Topics in Quantum Electronics, IEEE Journal of  (Volume:17 ,  Issue: 3 )

Date of Publication:

May-June 2011

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