By Topic

Femtosecond Radiation Experiment Detector for X-Ray Free-Electron Laser (XFEL) Coherent X-Ray Imaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Philipp, H.T. ; Lab. of Atomic & Solid State Phys., Cornell Univ., Ithaca, NY, USA ; Koerner, L.J. ; Hromalik, M.S. ; Tate, Mark W.
more authors

A pixel array detector (PAD) module has been developed at Cornell University for the collection of diffuse diffraction data in anticipation of coherent X-ray imaging experiments that will be conducted at the Linac Coherent Light Source (LCLS) at the SLAC National Accelerator Laboratory. The detector is designed to collect X-rays scattered from monochromatic femtosecond pulses produced by the LCLS X-ray laser at framing rates up to 120 Hz. Because X-rays will arrive on femtosecond time scales, the detector must be able to deal with instantaneous count-rates in excess of 1017 photons per second per pixel. A low-noise integrating front-end allows the detector to simultaneously distinguish single photon events in low-flux regions of the diffraction pattern, while recording up to several thousand X-rays per pixel in more intense regions. The detector features a per-pixel programmable two-level gain control that can be used to create an arbitrary 2-D, two-level gain pattern across the detector; massively parallel 14-bit in-pixel digitization; and frame rates in excess of 120 Hz. The first full-scale detector will be 1516 x 1516 pixels with a pixel size of 110 X 110 microns made by tiling CMOS ASICs (Application Specific Integrated Circuits) that are bump-bonded to high-resistivity silicon diodes. X-ray testing data of the first 185 X 194 pixel bump-bonded ASICs is presented. These are tiled to make the final detector. The measurements presented include confirmation of single photon sensitivity, pixel response profiles indicating a nearly single-pixel point spread function, radiation damage measurements and noise performance.

Published in:

Nuclear Science, IEEE Transactions on  (Volume:57 ,  Issue: 6 )