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Alpha-Particle Emission Energy Spectra From Materials Used for Solder Bumps

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7 Author(s)
Michael S. Gordon ; IBM T.J. Watson Research Center, Yorktown Heights, NY, USA ; Kenneth P. Rodbell ; David F. Heidel ; Conal E. Murray
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The emitted alpha particle energy distribution from solder bumps can show substantial surface emission which has a large impact on the modeled SEU rate. State-of-the art alpha-particle detectors are required to measure the low emissivity and energy distribution.

Published in:

IEEE Transactions on Nuclear Science  (Volume:57 ,  Issue: 6 )