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One of the major drawbacks in the typical design flow of electronic equipment is the lack of synchronization between design stages. Schematic design and thermal management are rarely correlated, although electrical and thermal parameters are very closely linked. Poor thermal design can have severe consequences on the reliability and functionality of the equipment and is often the main cause of component failure. As power density increases on the printed circuit board this problem becomes critical. Our paper presents a method of mixing electrical and thermal simulation with the goal of improving functional parameters and thermal stress behavior. Switching-mode power supply circuits have high power density and are likely to fail due to thermal stress, so as a support application for our method we will use a boost switching-mode power supply designed for automotive use.