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3D haptic handling of microspheres

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4 Author(s)
Bolopion, A. ; Inst. des Syst. Intelligents et de Robot., Univ. Pierre et Marie Curie - Paris 6, Paris, France ; Hui Xie ; Haliyo, D.S. ; Regnier, S.

In this paper, a fully teleoperated 3D micro assembly task with haptic feedback is presented. Microspheres (diameter: 4-6μm) are manipulated by pick-and-place. The setup is composed of a dual-tip gripper controlled through a haptic interface. To grasp the spheres, the tips must be correctly positioned with respect to the objects. The approach proposed to align the gripper is based on a user-driven exploration of the to-be-manipulated object. During this step, the haptic feedback is based on amplitude measurements from cantilevers in dynamic mode. Hence, the operator perceives the contact while freely exploring the manipulation area. A virtual guide is generated to pull the user to the optimum contact point, allowing correct positioning of dual tips. For the pick-and-place operation, the haptic feedback provides the user with information about the microscale interactions occurring during the operation. As experimental validation, a two-layer pyramid composed of four nylon microspheres is built in ambient conditions.

Published in:

Intelligent Robots and Systems (IROS), 2010 IEEE/RSJ International Conference on

Date of Conference:

18-22 Oct. 2010

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