By Topic

Spatial Light Phase Modulator With Bidirectional Tilt–Piston Micromirror Array—Part II: Fabrication and Experiment

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Yamashita, S. ; Fujitsu Labs. Ltd., Kawasaki, Japan ; Mita, M. ; Fujita, H. ; Yamamoto, Tsuyoshi
more authors

In part I of this paper, we have proposed a novel structure of microelectromechanical-systems-based 1-D spatial light phase modulator (SLPM). We have discussed the design of the device and derived the optimum parameters to satisfy the target specifications. In part II, we focus on the fabrication process and experimental results of the device. We show that this device configuration allows us to use a simple fabrication process. We fabricated the device consisted of 24 micromirrors and realized the tilt and piston motions successfully. The measured dc (rotation angle and displacement on driving voltage) and ac (frequency response) characteristics matched well to the simulated data derived in part I. We also examined the distribution of the resonant frequencies over 24 micromirrors and verified that the variance was kept within 2%. As one of the applications of the device, we applied the device to optical beam shaping and succeeded in shaping the optical beam properly depending on the surface patterns of the SLPM. With these achievements, we show that the device can be adopted to a wide variety of applications in optical communication systems and optical signal processing.

Published in:

Microelectromechanical Systems, Journal of  (Volume:20 ,  Issue: 1 )