By Topic

Time domain modeling of high-speed circuit structures with TLM

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

This paper describes two important new features necessary for the efficient modeling of transient electromagnetic signals in high-speed circuit structures using the time domain Transmission Line Matrix (TLM) method of analysis. These are the accurate representation of fields in the vicinity of sharp edges, and the modeling of packages using a hybrid TLM/Mode Matching approach in the transient regime

Published in:

Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting

Date of Conference:

28-30 Oct 1996