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Time domain modeling of high-speed circuit structures with TLM

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1 Author(s)
Hoefer, W.J.R. ; Victoria Univ., BC

This paper describes two important new features necessary for the efficient modeling of transient electromagnetic signals in high-speed circuit structures using the time domain Transmission Line Matrix (TLM) method of analysis. These are the accurate representation of fields in the vicinity of sharp edges, and the modeling of packages using a hybrid TLM/Mode Matching approach in the transient regime

Published in:

Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting

Date of Conference:

28-30 Oct 1996

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