By Topic

Process Development and Reliability of Microbumps

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Sharon Pei-Siang Lim ; Institute of Microelectronics (IME), Singapore ; Vempati Srinivasa Rao ; Wai Yin Hnin ; Wai Leong Ching
more authors

The use of flip-chip bonding technology on gold-tin (AuSn) microbumps for flip-chip packaging is becoming increasingly important in the electronics industry. Some of the main advantages of AuSn system over solder flip-chip technology are suitability for very fine pitch interconnection and fluxless bonding. Fluxless flip-chip assembly is in demand especially for medical applications and optoelectonics packaging. Here, we report the assembly process development of a silicon stacked module assembled with AuSn microbumps to meet the stringent reliability. The effects of bond pressure distribution, bond temperature and alignment accuracy were found to be critical in this stacked silicon using AuSn microbumps. A three-factor design of experiment was carried out to investigate the effects of assembly parameters such as bonding pressure, temperature and time on contact resistance and AuSn solder wetting on the electroless nickel and gold under bump metallization. Results showed that higher bond force is undesirable and contributes to passivation cracking and deformed AuSn joint with AuSn solder being squeezed out of the joint during bonding. The reliability result of the flip-chip assembly of stacked silicon module using AuSn microbumps was presented.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:33 ,  Issue: 4 )