By Topic

Multiobjective Optimization of a Grooved Micro-Channel Heat Sink

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Danish Ansari ; Department of Mechanical Engineering, Inha University, Incheon, South Korea ; Afzal Husain ; Kwang-Yong Kim

The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:33 ,  Issue: 4 )