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Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature

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3 Author(s)
Changsoo Jang ; Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA ; Han, B. ; Samson Yoon

We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100°C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:33 ,  Issue: 4 )

Date of Publication:

Dec. 2010

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